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AMTFlorida |
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Integrating People,
Equipment and Technology for Over Three Decades |
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BGA Rework Stations |
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Qualitek's BGA Rework Stations adopts
microprocessor control to solder and de-solder the surface mount
components safely and accurately. Unique Quicksoft software is utilized
to control, record and save the technical process. This high level of
control meets the demands of advanced electronic component packaging
repair with a user friendly sophisticated machine. Qualitek's Rework Stations adopts hot airflow technology and closed-loop principles, integrating the bottom infrared preheaters with the top and bottom hot air heaters. The advanced soldering process is optimally controlled by having up to 5000 Watts of heating power. The variable hot air flow control of both the top and bottom heaters provide a controlled rate of temperature rise, even heat distribution and minimal temperature differences. |
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Qualitek BGA 2005 Power: 1,600 W Max. PCB Size: 300 x 300mm Max Component Size: 40 x 40mm |
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Qualitek BGA 2015 Power: 3,000 W Max. PCB Size: 420 x 500mm Max Component Size: 60 x 60mm |
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Qualitek BGA 2025 Power: 3,500 W Max. PCB Size: 600 x 600mm Max Component Size: 60 x 60mm |
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Qualitek BGA 2100 Power: 5,000 W Max. PCB Size: 600 x 500mm Max. Component Size: 60 x 60mm |
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Please Contact Us
For More Information:
AMT Corp. |
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